SET – ACCµRA Plus
ACCµRA Plus is a flip-chip bonder designed for ± 0.5 µm accuracy in full automatic mode. It is suitable for reflow and thermocompression processes.
ACCµRA Plus combines high precision, flexibility and short cycle time. It is dedicated to production for Optoelectronic and Silicon photonics applications.
Applications
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Prisms, lenses, mirrors
- Micro Assembly
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
Industries
- Optoelectronics and Silicon Photonics
Description
Key Features
ACCµRA Plus
- Accuracy ± 0.5 µm
- High accuracy and high throughput
- Throughput 120 UPH
- Full automatic
- High flexibility and reliability
- Ultra-small dies
Technical Specifications
Contact us for more information
SET – ACCµRA Plus
Additional information
| Applications | Back-end |
|---|---|
| Markets | Taiwan |
| Solutions | Bonding Machine |
