SET – ACCµRA M
The ACCµRA M is a manual flip-chip bonder that allows ± 3 µm accuracy. This equipment permits to align manually the components with a high level of precision. The motorized arm controls precisely the bonding force. Combining and synchronizing the arm with the temperature controller, it guarantees a perfect quality and high repeatability of your process. The ACCµRA M, more than a pick-and-place system, offers thermocompression and reflow capabilities. It is the perfect equipment for universities and R&D institutes.
Description
Key Features
- Accuracy ± 3 µm
- Process controlled thanks to closed loop system
- Easy to use
- Granite structure offering high stiffness
- Vertical arm avoiding lateral shift during bonding
- Very small footprint on open platform
Applications
- Flip chip, die attach
- Chip-to-chip, chip-to-substrate
- Laser diode, laser bar
- VCSEL, photodiode
- LED
- Micro assembly
- MEMS, MOEMS, MCM
Key Industries
- Universities and R&D institutes
Additional information
| Applications | Back-end |
|---|---|
| Markets | Taiwan |
| Solutions | Bonding Machine |
