SET – FC150
The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.
The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.
Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.
Key Features
- Accuracy ± 1 µm
- Large range of bonding forces
- Perfect parallelism control
- Confining gas including formic acid
- Unique vision system
- Flexibility for research
- Automatization for pilot line
Technical Specifications
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Applications
- Infrared and X-Ray image sensors
- 3D-intergration
- Memory stacking
- Optoelectronics and Silicon Photonics
- Flip Chip bonding
- Mass Transfer of mini and micro LED
- Quantum Computing
- Die bonding
- Chip to Chip
- Chip to Wafer
- Nanoimprinting
Key Industries
- Infrared and X-Ray image sensors
- Semiconductors
- Memory
- Optoelectronics and Silicon Photonics
- Micro LEDs displays
- Quantum Computing
- Medical
Brand
SET, Smart Equipment Technology, is a world leading supplier of High Accuracy Flip Chip Bonders and versatile Nanoimprint Lithography (NIL) solutions. For 45 years, we have been designing and manufacturing semiconductor equipment dedicated to high precision applications.
We accompany laboratories and industries of semiconductor, which look for a high precision and an important reliability in the assembly of their components in their projects, and accelerate their developments of the chips of future thanks to our robust and precise flip-chip bonders.
With Device Bonders installed worldwide, SET is globally renowned for the unsurpassed sub-micron accuracy and the flexibility of its bonders. First introduced in 1981, the Flip-chip Bonder line became the primary focus of the company in 1997. Ranging from manual loading to fully automated version, our bonders cover a wide range of bonding applications and offer the unique ability to handle and bond fragile and small components onto substrate up to 300 mm.