Essemtec – Dispensing

  • TAIWAN

    DKSH Taiwan Ltd.
    10F, No. 22, Lane 407, Ti-Ding Blvd.,
    Section 2, NeiHu Technology Park
    114 Taipei, Taiwan

    +886 2 8752 6666

    Email

  • Essemtec Spider Brochure


  • Essemtec Tarantula Brochure


Equipped with the most modern, accurate systems that drive and steering technology offers today. Mediums rarely behave the same way, environmental conditions are significant for the behavior of liquid changes. This is why there is virtually no standard application in dispensing. Specific solutions for each dispensing task depending on both environmental influences and the type of liquid have to be evaluated. Easy programming and operation allow for a wide range of dispensing applications.

Available Models

Technical Specifications


Maximum dispensing speed


Piezo Jet Valve: 150‘000 dots/h

Dynamic Shockwave Valve: 80‘000 Dots/h
Time/Pressure Valve: 28‘000 Dots/h
Archimedean Screw Valve: 24‘000 Dots/h
Dispensing modeDot, line, curve, interpolated 3D contour
Placement XY dots accuracy40 μm (3σ)
Positioning Z axis accuracy20 μm (3σ)
PCB dimensions50 x 50 mm bis zu 406 x 305 mm (2 x 2” up to 16 x 12”)
Machine footprint dimensions880 x 1090 mm (34.7 x 43”)

Introducing – The Spider – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.

Technical Specifications

Maximum dispensing/jetting speedPiezo Jet Valve: 145‘000 dots/h
Dynamic Shockwave Valve: 720‘000 dots/h
Time/Pressure Valve: 26‘000 dots/h
Archimedean Screw Valve: 22‘000 dots/h
Dispensing modeDot, line, curve, interpolated 3D contour
Placement XY dots accuracy±40 μm (3σ)
Positioning Z axis accuracy±20 μm (3σ)
PCB dimensions560 x 610 mm (22 x 24“)
Machine footprint dimensions1’557 x 1’357 mm (61 x 53“)

Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.

Key Features

Dispense Technology

  • Up to 2 valves simultaneously
  • 5 different valves, large application range

Productivity

  • Up to 150’000 dots/h (with Piezo Jet Valve)
  • Up to 2’000’00o dot/h line mode

Small Footprint

  • Requires only 1 sqm of production floor
  • Machine fits through go cm wide door

Mineral Cast

  • No vibration, symmetrical mineral casting
  • No warpage, no thermal drift

Height Mapping

  • Mapping of heights using laser technology
  • Compensation of substrate warp / 3D contour

Linear Motors

  • Fast, reliable double drive linear motors
  • No maintenance, longest lifetime

Dispense Technology

  • Up to 3 dispense valves simultaneously
  • 5 different valves, large application range

Process Control

  • Monitoring sizes & weight of dispense dots
  • Process control adjustment and dot stabilisation

Productivity

  • Valve performance 20’000 – System opt. 180’000 dots/h
  • Up to 2’000’000 dots/h line mode

Large Dispense Area

  • PCB size 560 x 610 mm, optional 1800 x 610 mm
  • Up to 80 mm (3.35″) programmable Z stroke

Mineral Cast

  • No vibration, symmetrical mineral casting
  • No warpage, no thermal drift

Height Mapping

  • Mapping of heights using laser technology
  • Compensation of substrate warp / 3D contour

Linear Motors

  • Fast, reliable double drive linear motors
  • No maintenance, longest lifetime

Essemtec – SpiderCompact Highspeed Jetter and Dispenser 2023

Essemtec Spider, the extreme fast and compact jet and general dispenser is rated for up to 150’000 dots per hour, dispenses 3D patterns and much more.

Essemtec – Tarantula

Relentless All Terrain High Speed Dispensing

Introducing – The Tarantula – State of the art technology, easily integrated in any line. Wide range of dispensing applications such as Solder Paste and SMT Glue, LED Encapsulation, Silver Epoxy, Dam and Fill, Underfill, Cavity Fill, 3D Dispensing via laser height mapping and more.

Key Industries

  • Semiconductor, Solar & Electronics

Brand

Essemtec

Essemtec leads the industry in adaptive SMT pick-and-place equipment for both high-speed- and micro-dispensing, as well as an intelligent production storage and logistic systems. Our products are equipped with user-friendly software packages, enabling flexible mounting and dispensing design that is unique in the market, as well as extensive and efficient material management. The combination of printed circuit board (PCB) placement accuracy, speed, and high-quality engineering makes our offerings unique. Equipped with the most up-to-date technology, Essemtec products allow easy programming and operation for a wide range of applications.

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