Essemtec – Pick-and-Place
Designed for even more product changes per day, an even bigger range of components, increasing requirements for placement accuracy, speed and availability combined with high quality – naturally adaptive – engineering. Most feeders per sqm in the marketplace, intelligent set-up concepts, the largest board sizes together with the most compact system sizes and the falcon software based on Essemtec`s “eez-technology“ ensure highly e fficient and economical SMD manufacturing for service providers and in-house production.
Most feeders per sqm in the marketplace, intelligent set-up concepts, the largest board sizes together with the most compact system sizes and the falcon software based on Essemtec`s “eez-technology“ ensure highly efficient and economical SMD manufacturing for service providers and in-house production.
Available Models
Technical Specifications
| Fox 4 | Fox 2 | Fox | |
|---|---|---|---|
| Optimum Placement Speed | 31,000 cph (4-axes) |
17,500 cph (2-axes) |
9,100 cph (1-axis) |
| Optimum Jetting Speed | – | Solder Paste Jetting (dots/h) Max frequency: 780,000 / BGA pattern Jet-on-the-Fly: 480,000 Average board speed: 310,000 Piezo Jetting – Glue (dots/h) Max frequency: 2,000,000 / BGA pattern Jet-on-the-Fly: 780,000 BGA pattern Stop & Jet: 177,000 |
|
| Feeder Capacity 8 mm Tape | 200 (140 inline) | 180 (120 inline) | |
| Component Size Range | 008004 imp. (0201) up to 109 x 87 mm | ||
| Placement Accuracy (x, y) | Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ) | ||
| Max. PCB dimensions | 406 x 305 mm (16 x 12“) |
||
| Machine Footprint | 1,027 x 1,117 mm (40 x 44”) | ||
| Approx. Machine Weight (without / with full feeder) |
875 kg (1929 lb) / 1020 kg (2249 lb) |
||
Introducing – The Fox Pack – State-of-the-art technology. Expandable in any direction. The Fox can drive up to 200 feeder, illustrating its dedication to high-mix production. Due to its small footprint and reasonable weight, the machine is ideal for use in limited space production areas, even those located on upper floors.
Technical Specifications
| Puma 4 | Puma 2 | Puma | |
|---|---|---|---|
| Optimum Placement Speed | 30,000 cph (4-axes) |
17,400 cph (2-axes) |
9,000 cph (1-axis) |
| Optimum Jetting Speed | – | Solder Paste Jetting (dots/h) Max frequency: 780,000 / BGA pattern Jet-on-the-Fly: 480,000 Average board speed: 310,000 Piezo Jetting – Glue (dots/h) Max frequency: 2,000,000 / BGA pattern Jet-on-the-Fly: 780,000 BGA pattern Stop & Jet: 177,000 |
|
| Feeder Capacity 8 mm Tape | 280 (160 inline) | 260 (140 inline) | |
| Component Size Range | 008004 imp. (0201) up to 109 x 87 mm | ||
| Placement Accuracy (x, y) | Chip ± 40 μm (3σ) / QFP ± 30 μm (3σ) | ||
| Max. PCB dimensions | 560 x 610 mm (22 x 24”) optional 1,830 x 610 mm (72 x 24”) |
||
| Machine Footprint | 1,557 x 1,357 mm (61 x 53”) | ||
| Approx. Machine Weight (without / with full feeder) |
1670 kg (3680 lb) / 1920 kg (4233 lb) | ||
Introducing – The Puma – State of the art technology. Expandable in any direction. Same as in nature our Puma is common modular and adaptive in all kinds of environment. With different modules the systems grow synchronously with the customer’s requirements for performance and processes. Puma is world`s best highspeed Pick-and-Place solution which can also be used in ultraflexible, rapid prototyping development.
Key Features
| Fox.ultra | Puma.ultra | |
|---|---|---|
| Combined Process | ．Placing & dispensing in single pass-through ．Jet dispensing of solder paste or glue | ．Highspeed placing and dispensing in single pass-through ．1, 2 or 4 placement-axes and 1-2 dispense processes |
| Productivity | ．Up to 1000 – 18,800 cph per module ．Up to 56,400 cph per line (3 modules) | ．Optimum 18,100 cph, up to 54,300 cph inline ．Optimum jetting speed 180,000 – 720,000 dots/h |
| Small Footprint | ．Up to 200 feeder lanes on 1 sqm ．Up to 420 feeder lanes per line | ．Up to 280 Feeder on 2 ㎡ (up to 420 inline) ．PCB size 560 x 610 mm, optional 1800 x 610 mm |
| Mineral Cast | ．No vibration, symmetrical mineral casting ．No warpage, no thermal drift | ．No vibration, symmetrical mineral casting ．No warpage, no thermal drift |
| Quick Changeover | ．Nonstop production, intelligent smart feeder ．Nonstop feeder and production changeover | ．Nonstop production, intelligent smart feeder ．Nonstop feeder and production changeover |
| Linear Motors | ．Fast, reliable double drive linear motors ．No maintenance, longest lifetime | ．Fast, reliable double drive linear motors ．No maintenance, longest lifetime |
Essemtec Application – Puma and Fox on the Hunt
Application clip of our Pick-and-Place “beasts” Fox and Puma. All Scenes from our product videos raw in real-time. No fast-forward, no effects, no post stabilization.
Essemtec – Puma
Puma is the world’s first high-speed pick and place solution that can also be used in the ultra-flexible prototyping development sector.
Key Industries
- Semiconductor, Solar & Electronics
Essemtec leads the industry in adaptive SMT pick-and-place equipment for both high-speed- and micro-dispensing, as well as an intelligent production…
