SET – ACCµRA OPTO
The ACCµRA OPTO is a flip-chip bonder that allows ± 0.5 µm accuracy. It is dedicated to low force and reflow processes. The ACCµRA OPTO combines high precision, flexibility and accessibility. It is the perfect equipment for optoelectronics and silicon photonics applications.
Description
Key Features
- Accuracy ± 0.5 µm
- Low bonding force
- Confining gas
- Easy to use and very flexible
- Quick set-up of new applications
- Small footprint and compact design
Technical Specifications
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Applications
- Laser diode, laser bar
- VCSEL, photo diode
- LED
- Prisms, lenses, mirrors
- Micro Assembly
- Flip-chip bonding, die bonding
- Chip-to-chip, chip-to-substrate bonding
Key Industries
- Optoelectronics and Silicon Photonics
Additional information
| Applications | Back-end |
|---|---|
| Markets | Taiwan |
| Solutions | Bonding Machine |
