SET – NEO HB
NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.
Applications
- Hybrid / Direct bonding (room temperature)
- Flip-chip bonding, die bonding
- Chip-to-wafer, wafer level applications
- Chip-to-substrate bonding
- Pick & Place
- Memory stacking
- 3D IC
Description
Key Features
NEO HB
- High post-bonding accuracy ± 1 µm @ 3σ
- High throughput 1,000 uph
- Stand alone or full automatic
- Cleanliness level ISO 5 stand alone
- Cleanliness level ISO 3 full automatic
- High flexibility and reliability
- Creative design
Technical Specifications
Contact us for more information
SET – NEO HB
Key Industries
- Semiconductor, Solar & Electronics
Additional information
| Applications | Back-end |
|---|---|
| Markets | Taiwan |
| Solutions | Bonding Machine |
