SET – FC150
The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.
The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.
Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.
Description
Key Features
- Accuracy ± 1 µm
- Large range of bonding forces
- Perfect parallelism control
- Confining gas including formic acid
- Unique vision system
- Flexibility for research
- Automatization for pilot line
Technical Specifications
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Applications
- Infrared and X-Ray image sensors
- 3D-intergration
- Memory stacking
- Optoelectronics and Silicon Photonics
- Flip Chip bonding
- Mass Transfer of mini and micro LED
- Quantum Computing
- Die bonding
- Chip to Chip
- Chip to Wafer
- Nanoimprinting
Key Industries
- Infrared and X-Ray image sensors
- Semiconductors
- Memory
- Optoelectronics and Silicon Photonics
- Micro LEDs displays
- Quantum Computing
- Medical
Additional information
| Applications | Back-end |
|---|---|
| Markets | Taiwan |
| Solutions | Bonding Machine |
