Showing 121–135 of 152 results

  • SET – ACCµRA100

    The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines...

    The ACCµRA100 is a flip-chip bonder that allows ± 0.5 µm accuracy. Motorized axes guarantee a high repeatability of your process. Its flexibility makes it ideal for developing a wide range of applications. ACCµRA100 combines high precision, accessibility and cost-effectiveness. It is the perfect equipment for universities and R&D institutes.

    Applications

    • Micro assembly
    • Laser diode, laser bar
    • VCSEL, photo diode
    • LED
    • Flip-chip bonding, die bonding
    • Chip-to-chip, chip-to-substrate bonding
    • MOEMS, MEMS, MCM packaging…
    • 3D packaging
    • Nanoimprinting (UV NIL and Hot Embossing)

    Industries

    • Semiconductors
    • Memory
    • Optoelectronics and Silicon Photonics
    • Micro LEDs Displays
    • Quantum Computing
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  • SET – FC150

    The FC150 is an accurate and very flexible flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 200 mm) applications on the same open platform.

    The versatile design and the possibility to combine different processes make the FC150 ideal for developing a wide range of assembly applications including focal plane arrays and optoelectronic devices.

    Perfect for advanced R&D, the FC150 is also appreciated for pilot production thanks to its full automatization.

     

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  • SET – FC300

    The FC300 is a high accuracy and high force flip-chip bonder for Chip-to-Chip (up to 100 mm) and Chip-to-Wafer (up to 300 mm) applications. FC300 covers a large range of bonding forces, from 1 to 4000N. That makes it perfectly suitable for reflow and thermocompression processes.

    The leveling between both components is adjusted before each bonding within 1 µradian. The parallelism adjustment, the high resolution alignment and the perfect control of all bonding parameters allow to achieve submicronic post-bond accuracy.

     

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  • SET – LDP150

    The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

    ...

    The LDP150 is an electrical Press especially designed for bonding large light or radiation detectors (50 ~ 150mm). It uses compression process at room temperature (thermo-compression option available).

    A predefined gap can be achieved between two components previously pre-bonded using a high accuracy device bonder such as the SET FC150. The devices are pressed together at room temperature while preserving the initial high accuracy alignment and parallelism.

    The LDP150 is able to apply pressure up to 100,000N.

    Applications

    • Large infrared focal plane arrays
    • Military and space applications
    • Large XY, UV detector
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  • SET – NEO HB

    NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time...

    NEO HB is a flip-chip bonder designed for ± 1 µm @ 3σ accuracy in stand-alone or full automatic mode (EFEM). It is suitable for Hybrid/Direct bonding processes. NEO HB combines high precision, flexibility and short cycle time. It is dedicated for production.

    Applications

    • Hybrid / Direct bonding (room temperature)
    • Flip-chip bonding, die bonding
    • Chip-to-wafer, wafer level applications
    • Chip-to-substrate bonding
    • Pick & Place
    • Memory stacking
    • 3D IC
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  • SET – NPS300

    Optimized for the production of nanostructures, the Nano imPrinting stepper Stepper NPS300 is the first ever tool able to combine Hot Embossing and UV-NIL on a same platform. The NPS300 is able to print sub-20 nm geometries with an overlay accuracy of 250 nm, when in-situ alignment is performed. Its flexible architecture offers an excellent process reproducibility and a unique ability to pattern large areas, in a sequential step and repeat mode on wafers up to 300 mm. It enables the low cost manufacturing of large stamps featuring repeated patterns.

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  • Solida – Laboratory Bioreators

    Solida Biotech manufacture a wide range of bioreactors, fermenters, at-line analysers, CIP/SIP systems and process vessels for research, development, and production, suitable for fermentation, cell culture, stem cells, enewable technologies, algae...

    Solida Biotech manufacture a wide range of bioreactors, fermenters, at-line analysers, CIP/SIP systems and process vessels for research, development, and production, suitable for fermentation, cell culture, stem cells, enewable technologies, algae, biomass, biofuel, hydrolysis and more.

    Solida Biotech Advantages

    • Flexibility
    • Custom made solutions
    • Complete Engineering management
    • Full control of the manufacturing chain including third party suppliers
    • Automation and Software solutions for laboratory and industrial applications
    • High quality Stainless steel and ancillary components
    • Competitive Prices
    • Efficient after sales support
    • Turn-Key projects
    • Searching and Transferring of Technologies
    • Application support for Fermentation, Cell Culture and Renewable energies
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  • Solida Biotech Bioprocess Analysers

    Laboratory and industrial production process control requires a fast and accurate analysis of sample to allow optimum operating conditions to be set and maintained. This can apply equally to food and beverage production, pharmaceutical products or...

    Laboratory and industrial production process control requires a fast and accurate analysis of sample to allow optimum operating conditions to be set and maintained. This can apply equally to food and beverage production, pharmaceutical products or biopharmaceutical manufacturing systems for both cell culture and microbial applications. The speed and flexibility of our enzymatic laboratory analysers makes them ideal for quality control purposes. A printed result is obtained typically within 20 – 25 seconds from sample injection. New analytical assays are continually being developed; for example measurement of methanol from dimethyl dicarbonate (DMDC) preservation of juices and other beverages but also NAD and NADH for industrial control purposes.

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  • Sopat – Microscope Probe – MM-Probe

    ...

    The SOPAT MM-Probe is a microscope probe with high magnification. It is characterized by its high resolution and is especially suited to characterizing biological systems (Yeast cells, bacteria, algae, water purification, etc.) as well as fine emulsions with drop sizes of 1 µm and larger

     

    Application examples for particle analysis with the SOPAT microscope probe

    • Body lotions, toothpaste
    • Mayonnaise
    • Creams
    • Algae
    • Bacteria
    • Yeast cells
    • Fine emulsions
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  • Sopat – Probe – Macroscopic Probes

    SOPAT Macroscopic probes are probes for particle size analysis in the range of 70 to 26,000 µm.

    SOPAT Macroscopic probes are probes for particle size analysis in the range of 70 to 26,000 µm.

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  • Sopat – Probe – Mesoscopic Probes

    Ideal for the range of 1.5 to 2,600 µm. They are autoclavable and therefore suited for CIP (cleaning in place) and SIP (sterilization in place).

    Individual customization possibilities for your process...

    Ideal for the range of 1.5 to 2,600 µm. They are autoclavable and therefore suited for CIP (cleaning in place) and SIP (sterilization in place).

    Individual customization possibilities for your process’s needs

    • Length
    • Pressure resistance
    • Temperature
    • Material

    For corrosive mediums, the parts of the system that come into contact can be fashioned out of C22 Hastelloy or titanium. The SOPAT stick probes are mesoscopic incident light probes and can be equipped with a U-Light as a transmission probe if desired.

    Application examples for particle analysis with the SOPAT Mesoscopic probes

    • Emulsions
    • Chocolate
    • Grinding processes such as ball mills
    • Fluid bed granulation
    • Spray drying
    • Polymerization
    • Crystallization
    • Dispersion
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  • Studer – Conventional Cylindrical Grinding Machines – S20 & S30

    STUDER conventional cylindrical grinding machines are designed for the grinding of workpieces in individual as well as small and large series production operations.

    The S20 is designed...

    STUDER conventional cylindrical grinding machines are designed for the grinding of workpieces in individual as well as small and large series production operations.

    The S20 is designed for grinding medium-sized workpieces in individual and batch production. It is suitable for use in any industry where precise small components are manufactured. Operation is very simple and the machine can be reset very quickly.

    The S30 is designed for grinding workpieces in individual and small batch production. It is suitable for use in any industry where precise medium-sized workpieces are manufactured. Operation is very simple and the machine can be reset very quickly.

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  • Studer – External Universal Cylindrical Grinding Machines

    From the entry level machine for the most important applications to the all-rounder for complex grinding tasks. Small to large workpieces for individual, small and large-scale production. You have the choice between five universal cylindrical grin...

    From the entry level machine for the most important applications to the all-rounder for complex grinding tasks. Small to large workpieces for individual, small and large-scale production. You have the choice between five universal cylindrical grinding machines with center distances of 400mm (15.7″), 650mm (25.6″), 1000mm (40″) and 1600mm (63″) and a center height of 175mm (6.9″).

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  • Studer – Internal Cylindrical Grinding Machines

    The internal cylindrical grinding machines are designed to solve almost anything you need: Flange parts, spindle shafts, spindle housings, rotor shafts, bushes and much more for the areas of machine tools, drive elements, aerosp...

    The internal cylindrical grinding machines are designed to solve almost anything you need: Flange parts, spindle shafts, spindle housings, rotor shafts, bushes and much more for the areas of machine tools, drive elements, aerospace and toolmaking.

    Whether flange parts or spindles up to 1 300 mm (51.1″) in length, the universal internal cylindrical grinding machines can master any challenge.

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  • Studer – Production Cylindrical Grinding Machines – S11 & S22

    The Studer S11 production cylindrical grinding machine is the youngest S11 and the smallest machine in the company’s portfolio and is tailor-made for workpieces up to 200 mm in length.

    If space-sa...

    The Studer S11 production cylindrical grinding machine is the youngest S11 and the smallest machine in the company’s portfolio and is tailor-made for workpieces up to 200 mm in length.

    If space-saving is your priority, then the S11 is the right machine for you. In a space of less than 1.8 m² the S11 produces extremely efficiently and reliably with a grinding wheel diameter 500 mm.

    On the other hand, if productivity is important to you, we recommend the S22. This is a production platform, which is precisely configured for your grinding tasks. The S22 can be perfectly integrated into your production line. It allows you to machine medium-sized workpieces with different technologies.

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